Main Forum

I. Conference Background

At present, embodied intelligence, as the core direction of artificial intelligence's leap from "perceptual intelligence" to "action intelligence," has become a key focus area for the "15th Five-Year Plan" future industry layout and a critical pillar for promoting high-end, intelligent, and green transformation of manufacturing. China's embodied intelligence industry is at a crucial stage characterized by accelerated technological breakthroughs, expanding application scenarios, and initial ecosystem formation. However, it also faces prominent challenges such as core technology bottlenecks, insufficient localization of components, difficulty in scenario implementation, lack of standard systems, and talent shortages. In response to national strategic deployment, to build a collaborative platform connecting government, industry, academia, research, and application, to address industry development bottlenecks, and to promote high-quality development of the embodied intelligence industry, the China Mechatronics Technology Application Association is organizing the 2026 Embodied Intelligence Industry Ecosystem Conference during the 2026 Shanghai International Embodied Intelligence Industry Expo. The conference adopts a "1+4" framework (1 main forum + 4 thematic forums), bringing together industry strengths to discuss ecological co-construction pathways and promote collaborative industry upgrading.

II. Organizational Structure

Hosts:

China Association for Mechatronics Technology and Application (CAMETA)

Organizers:

China General Machine Components Industry Association

Embodied Intelligence Branch of China Mechatronics Technology Application Association

Standards Committee of China Mechatronics Technology Application Association

Shanghai International Exhibition (Group) Co., Ltd.

Saikong Netwo
III. Conference Content Framework